Moire Interferometry and Electronic Packaging

Moire Interferometry is a powerful photomechanics technique that can produce full-field strain measurements with remarkable resolution. Illustrated in the photos are solder balls in an electronic package with the moire fringes representing contours of displacement with sub-micron resolution per fringe. This work was performed for a patent infringement case where moire interferometry was able to establish the validity of specific claims for my client and confirm infringement.