Moire Interferometry and Electronic Packaging

Dr. Perry | December 18, 2000

Moire Interferometry is a powerful photomechanics technique that can produce full-field strain measurements with remarkable resolution. Illustrated in the photos are solder balls in an electronic package with the moiré fringes representing contours of displacement with sub-micron resolution per fringe. This work was performed for a patent infringement case where moiré interferometry was able to establish the validity of specific claims for my client and confirm infringement.

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